意法半导体STM32H725/735系列微控制器选型表及现货

来源：中芯巨能：提供选型指导+现货供应+技术支持| 发布日期：2024-10-08 16:00:01 浏览量：

意法半导体STM32H725/735系列内含工作频率高达550 MHz的Arm® Cortex®-M7内核（具有双精度浮点单元），可选扩展室温范围最高为125 °C (*)。采用BGA和LQFP配置文件，提供100至176引脚的封装，以及VFQFN68和WLCSP115封装。代理销售意法半导体旗下全系列IC电子元器件-中芯巨能为您提供意法半导体STM32H730超值系列选型表及现货。

中芯巨能现货供应意法半导体STM32H730系列产品，2小时可发货，为制造业厂家提供选型指导+样片测试+技术支持等服务。如需选型指导、样片测试、采购、BOM配单等需求，请加客服微信：13310830171。

型号	描述	封装
STM32H725AE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H725AG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H725IE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H725IG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H725RE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	VFQFPN 68 8x8x1.0 mm
STM32H725RG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	VFQFPN 68 8x8x1.0 mm
STM32H725VE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm
STM32H725VG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm, WLCSP 115 3.8x4.2x0.6 P 0.35 mm
STM32H725ZE	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 512 KBytes Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 144 20x20x1.4 mm
STM32H725ZG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals	LQFP 144 20x20x1.4 mm
STM32H735AG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	UFBGA 169 7x7x0.6 P 0.5 mm
STM32H735IG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 176 24x24x1.4 mm, UFBGA 176+25 10x10x0.6 P 0.65 mm
STM32H735RG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	VFQFPN 68 8x8x1.0 mm
STM32H735VG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 100 14x14x1.4 mm, TFBGA 100 8x8x1.2 P 0.8 mm, WLCSP 115 3.8x4.2x0.6 P 0.35 mm
STM32H735ZG	High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, extenal memory interface, SMPS, subset of peripherals including a Crypto accelerator	LQFP 144 20x20x1.4 mm